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Preheating to 100°C for 45 sec. max. Keep flux flush with top surface of PCB; do not apply to component side of PCB and area where terminals are located. Soldering to 255°C for 5 sec. max. Clean by brushing on solder surface. Do not clean switch with solvents.
Features.
Suitable for high density mounting.
Reflow solderable.
Horizontal type capable of operating in horizontal to PCB.
Can be packed on Tape Reel.
Ultra thin low profile
Spec.
Model No. | TS-B011 | |
Terminal Type | DIP | |
Switch Rating | 50mA DC 12V | |
Operation Travel | 0.2±0.1mm | |
Operation Tpye | Momentary | |
Operation Force | 160/180/250 gf | |
Operation Life | 300,000 Cycles | |
Contact Resistance | ≤100mΩ max | |
Insulation Resistance | ≥100MΩ/m DC 250V | |
Dielectric Strength | AC 250V/m 50Hz | |
Operation Temperature | -30℃ to + 85℃ | |
Operation Humidity | 25-85% RH | |
Solder Ability | 260±5℃ for 3 seconds |
Drawing.